由 ACM SIGBED China(国际计算机学会嵌入式系统专业委员会中国区分会)主办、哈尔滨工业大学郑州研究院与河南好韵文化传播有限公司联合承办,哈尔滨工业大学人工智能研究院、哈尔滨工业大学人工智能研究院有限公司和超聚变数字技术有限公司协办的 2025 嵌入式智能大会(EIS 2025)将于 2025 年 11 月 28 日 — 30 日在郑州召开。 // The 2025 Embedded Intelligence Summit (EIS 2025), hosted by ACM SIGBED China (the Chinese division of the ACM Special Interest Group on Embedded Systems), and co-organized by Harbin Institute of Technology Zhengzhou Research Institute and Henan Haoyun Culture and Communication Co., Ltd., with assistance from the Harbin Institute of Technology Institute for Artificial Intelligence, Harbin Institute of Technology Research Institute for Artificial Intelligence Inc. and xFusion Digital Technologies Co., Ltd., will be held in Zhengzhou, from November 28 to 30, 2025.
作为依托于ACM的中国区大会,嵌入式智能大会(EIS)自2019年创立以来,受到学术界、产业界乃至各级政府的广泛关注与高度重视,每年吸引数百名专家学者、行业精英、技术高管和青年才俊出席,已经成为国内人工智能与嵌入式系统交叉融合领域的年度盛会。 // As the China regional conference supported by ACM, the Embedded Intelligence Summit (EIS) has garnered widespread attention and high regard from academia, industry, and various levels of government since its inception in 2019. Each year, it attracts hundreds of experts, scholars, industry elites, technical executives, and young talents, becoming an annual event in the field of cross-integration of artificial intelligence and embedded systems in China.
2025嵌入式智能大会以“具身具智,联物联新”为主题,聚焦智能物联网、具身智能、物理信息融合系统等前沿方向,汇聚全球嵌入式智能领域众多有影响力的学术大咖、科技中坚、企业家及青年才俊,分享最新研究成果与技术进展。大会将设有多场主旨报告和论坛。此外,本次大会还将举行ACM SIGBED China优博奖、新星奖等颁奖典礼,表彰在嵌入式系统领域做出杰出贡献的学者与研究人员,激励更多的创新成果与跨领域合作。 // The 2025 Embedded Intelligence Summit, with the theme "Embodied Intelligence, Connected New World" will focus on cutting-edge areas such as intelligent IoT, embodied intelligence, and cyber-physical systems. It will feature academic discussions, peak dialogues, technical exchanges, and sharing of practical experiences. Additionally, the event will host award ceremonies for ACM SIGBED China's Outstanding Doctoral Dissertation Award and Rising Star Award, recognizing scholars and researchers who have made outstanding contributions to the field of embedded systems and inspiring more innovative achievements and cross-disciplinary collaborations.
我们期待您届时莅临现场,与众多业界有影响力的学术大咖、科技中坚、企业家及青年才俊共同交流、相互碰撞,览行业之势,博众家之见,谋实践之策,以期推动嵌入式人工智能产业的发展与应用。 // We look forward to your presence at the event, where you will have the opportunity to engage with influential academic luminaries, technological leaders, entrepreneurs, and young talents. Together, we will explore industry trends, exchange insights, and devise practical strategies, aiming to advance the development and application of embedded artificial intelligence industries.
关于ACM SIGBED China // About ACM SIGBED China
ACM全称为Association for Computing Machinery,即国际计算机学会,创立于1947年,是全世界计算机领域影响力最大的专业学术组织。其所评选的图灵奖(A.M. Turing Award)被公认为世界计算机领域的诺贝尔奖。也是是全球历史最悠久和最大的计算机教育和科研机构,目前在全世界130多个国家和地区拥有超过10万名的会员。 // ACM, which stands for the Association for Computing Machinery, was founded in 1947 and is the most influential professional academic organization in the field of computer science worldwide. The Turing Award awarded by ACM is widely recognized as the Nobel Prize in the computer science field. It is also the oldest and largest computer education and research institution globally, with over 100,000 members in more than 130 countries and regions.
ACM SIGBED China(国际计算机学会嵌入式系统专业委员会中国区分会)是依托ACM和ACM SIGBED建立的面向嵌入式系统领域的专业委员会,致力于为嵌入式系统、智能物联网、电子设计自动化及相关领域的专家学者和工业界研发人员提供交流的平台,将先进的嵌入式技术推广至各大应用领域,促进产学研合作。 // ACM SIGBED China is established under the umbrella of ACM Special Interest Group on Embedded Systems (SIGBED). It is dedicated to providing a platform for researchers in the fields of embedded systems, intelligent IoT, electronic design automation, and related areas to exchange ideas and promote advanced embedded technology across various application domains, fostering collaboration between academia and industry.
中国·郑州 // Zhengzhou·China | 2025.11.28 – 2025.11.30
河南省无人机行业协会 // Henan Unmanned Aerial Vehicle Industry Association
清华大学 // Tsinghua University
香港大学 // The University of Hong Kong
北京大学 // Peking University
上海交通大学 // Shanghai Jiao Tong University
山东大学 // Shandong University
University of Belgrade // University of Belgrade
西安电子科技大学 // Xidian University
北京理工大学 // Beijing Institute of Technology
浙江大学 // Zhejiang University
西北工业大学 // Northwestern Polytechnical University
中国农科院信息所 // Chinese Academy of Agricultural Sciences Information Institute
暨南大学 // Jinan University
中国科学院大学 // University of Chinese Academy of Sciences
北京通用人工智能研究院 // Beijing General Artificial Intelligence Research Institute
哈尔滨工业大学 // Harbin Institute of Technology
华南农业大学 // South China Agricultural University
北京理工大学 // Beijing Institute of Technology
东南大学 // Southeast University
黄河水利科学研究院 // Yellow River Institute of Hydraulic Research
哈尔滨工业大学 // Harbin Institute of Technology
超聚变数字技术有限公司 // xFusion Digital Technologies Co., Ltd.
西北农林科技大学 // Northwest A&F University
南京大学 // Nanjing University
哈尔滨工业大学郑州研究院 // Harbin Institute of Technology, Zhengzhou Research Institute
中科院计算所 // Institute of Computing Technology, Chinese Academy of Sciences
西北工业大学 // Northwestern Polytechnical University
清华大学 // Tsinghua University
浙江灵巧智能科技有限公司 // Zhejiang Lingqiao Intelligent Technology Co., Ltd.
清华大学 // Tsinghua University
浙江大学 // Zhejiang University
英国埃克塞特大学 // University of Exeter
香港科技大学 // The Hong Kong University of Science and Technology
UT Austin // UT Austin
香港科技大学 // The Hong Kong University of Science and Technology
哈尔滨工业大学(深圳) // Harbin Institute of Technology, Shenzhen
Agricultural University of Athens Greece // Agricultural University of Athens Greece
香港城市大学 // City University of Hong Kong
北京大学 // Peking University
中国科学技术大学 // University of Science and Technology of China
华为边缘云创新实验室 // Huawei Edge Cloud Innovation Lab
华为边缘云创新实验室 // Huawei Edge Cloud Innovation Lab
清华大学 // Tsinghua University
北京智源人工智能研究院 // Beijing Institute of Artificial Intelligence
清华大学 // Tsinghua University
中国信息通信研究院 // China Information and Communications Research Institute
南京大学 // Nanjing University
南京大学 // Nanjing University
香港中文大学 // The Chinese University of Hong Kong
香港中文大学 // The Chinese University of Hong Kong
电子科技大学 // University of Electronic Science and Technology of China
电子科技大学(深圳)高等研究院 // Institute for Advanced Study, University of Electronic Science and Technology of China (Shenzhen)
大连理工大学 // Dalian University of Technology
上海交通大学 // Shanghai Jiao Tong University
清华大学 // Tsinghua University
香港城市大学 // City University of Hong Kong
西北工业大学 // Northwestern Polytechnical University
哈尔滨工业大学(深圳) // Harbin Institute of Technology, Shenzhen
北京航空航天大学 // Beihang University
中国科学技术大学 // University of Science and Technology of China
中国科学技术大学 // University of Science and Technology of China
太原理工大学 // Taiyuan University of Technology
中国农业大学 // China Agricultural University
中国科学院大学 // University of Chinese Academy of Sciences
解放军信息工程大学 // Information Engineering University
Massachusetts Institute of Technology // Massachusetts Institute of Technology
西北工业大学 // Northwestern Polytechnical University
北京理工大学 // Beijing Institute of Technology
哈尔滨工业大学 // Harbin Institute of Technology
2025年度新星奖 // 2023 Rising Star Award
上海交通大学 // Shanghai Jiao Tong University
2025年度新星奖 // 2023 Rising Star Award
中山大学 // Sun Yat-sen University
2025年度新星奖 // 2023 Rising Star Award
南京大学 // Nanjing University
2025年度优博奖 // 2023 Excellent Doctor Award
华中科技大学 // Huazhong University of Science and Technology
2025年度优博奖 // 2023 Excellent Doctor Award
香港城市大学 // City University of Hong Kong
2025年度优博奖 // 2023 Excellent Doctor Award
中国,郑州,哈工大郑州研究院(郑州市郑东新区中原科技城龙源东七街26号) // Harbin Institute of Technology Zhengzhou Research Institute (No. 26 Longyuan East 7th Street, Zhongyuan Science and Technology City, Zhengzhou City, China)
推荐酒店 // Recommended Hotel
郑州东区希尔顿逸林酒店(大床/标双¥480)河南省郑州市金水区顺意街20号 // Zhengzhou East District DoubleTree by Hilton Hotel (King bed / Standard double ¥480, No. 20 Shunyi Street, Jinshui District, Zhengzhou City, Henan Province)
订房电话:15516167263(酒店销售-曹经理) // Tel. 15516167263(Hotel sales - Manager Cao)
扫描酒店官方二维码,可直接线上预定 // Scan the hotel's official QR code to directly book online